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in reply to lacaio πŸ‡§πŸ‡·πŸ΄β€β˜ οΈπŸ‡ΈπŸ‡΄

Article is about research by IMEC (a chip packaging company) into dealing with the heat problems encountered with stacked dies such as HBM memories with a GPU.

You have to get a third of the way in before they really get to the topic.

in reply to wewbull

IMEC (a chip packaging company)


That's not what IMEC is : "Interuniversity Microelectronics Centre is an international research & development organization, active in the fields of nanoelectronics and digital technologies" and it's a non profit. They basically do research for and with the semi industry.

in reply to utopiah

Ok. I'm not familiar with them. I was just relaying my impression from the start of the article.
in reply to wewbull

No worries, it's a very niche thing but IMHO interesting to dig deeper into if you are curious about the semi conductor industry.
This entry was edited (2 weeks ago)
in reply to utopiah

I work in the semiconductor industry, but have little to do with physical aspects.
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